MRF6V10250HSR3
9
RF Device Data
Freescale Semiconductor
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
?
Electromigration MTTF Calculator
For Software, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the Software &
Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Feb. 2008
?
Initial Release of Data Sheet
1
June 2008
?
Added 25 W Avg. to Typical Pulsed Performance bullet, p. 1
?
Added Pulsed to Fig. 6, Pulsed Output Power versus Input Power Y axis label to better clarify
performance, p. 5
?
Corrected Fig. 9 title to read: Pulsed Output Power versus Input Power, p. 6
2
Apr. 2010
?
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table and related
?Continuous use at maximum temperature will affect MTTF? footnote added, p. 1
?
Reporting of pulsed thermal data now shown using the ZθJC
symbol,p.1
?
Added Electromigration MTTF Calculator availability to Product Software, p. 9
LIFETIME BU
Y
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